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this is information on a product in full production. january 2014 docid8190 rev 8 1/13 hcf4010 hex buffer/converter (non-inverting) datasheet - production data features ? propagation delay time ?t pd = 50 ns (typ.) at v dd = 10 v, c l = 50 pf ? high to low level logic conversion ? multiplexer: 1 to 6 or 6 to 1 ? high ?sink? and ?sourc e? current capability ? quiescent current specified up to 20 v ? 5 v, 10 v and 15 v parametric ratings ? input leakage current ? i i = 100 na (max.) at v dd = 18 v, t a = 25 c 100% tested for quiescent current ? esd performance ?cdm: 1 kv ?hbm: 1 kv ? mm: 150 v applications ? automotive ? industrial ? computer ? consumer description the hcf4010 device is a monolithic integrated circuit fabricated in mos (metal oxide semiconductor) technology available in an so16 package. it is a non-inverting hex buffer/converter and can be used as a cmos to ttl logic level converter, as a current ?sink? or ?source? driver, or as a multiplexer (1 to 6). it is the preferred replacement of the hcf4050b in buffer applications. so16 table 1. device summary order code temperature range package packing marking hcf4010m013tr ?55 c to +125 c so16 tape and reel hcf4010 HCF4010YM013TR (1) ?40 c to +125 c so16 (automotive grade) hcf4010y 1. qualification and characterization acco rding to aec q100 and q003 or equivalen t, advanced screening according to aec q001 and q002 or equivalent. www.st.com
contents hcf4010 2/13 docid8190 rev 8 contents 1 pin information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.1 so16 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
docid8190 rev 8 3/13 hcf4010 pin information 13 1 pin information figure 1. pin connections table 2. pin description pin number symbol/name function 3, 5, 7, 9, 11, 14 a, b, c, d, e, f data inputs 2, 4, 6, 10, 12, 15 g, h, i, j, k, l data outputs 13 nc not connected 1v cc positive supply voltage 8v ss negative supply voltage 16 v dd positive supply voltage
functional description hcf4010 4/13 docid8190 rev 8 2 functional description figure 2. input equivalent circuit table 3. truth table inputs (a, b, c, d, e, f) outputs (g, h, i, j, k, l) ll hh
docid8190 rev 8 5/13 hcf4010 electrical characteristics 13 3 electrical characteristics absolute maximum ratings are those values be yond which damage to the device may occur. functional operation under these conditions is not implied. all voltage va lues are referred to v ss pin voltage. table 4. absolute maximum ratings symbol parameter value unit v dd supply voltage -0.5 to +22 v v i dc input voltage -0.5 to v dd + 0.5 i i dc input current 10 ma p d power dissipation per package 200 mw power dissipation per output transistor 100 t op operating temperature -55 to +125 c t stg storage temperature -65 to +150 table 5. recommended operating conditions symbol parameter value unit v dd supply voltage 3 to 20 v v i input voltage 0 to v dd t op operating temperature so16 -55 to 125 c so16 (automotive grade) -40 to 125
electrical characteristics hcf4010 6/13 docid8190 rev 8 table 6. dc specifications (1) sym. parameter test condition value unit v i (v) v o (v) |i o | ( a) v dd = v cc (v) t a = 25 c -40 to 85 c -55 to 125 c min. typ. max. min. max. min. max. i l quiescent current 0/5 5 0.02 1 30 30 a 0/10 10 0.02 2 60 60 0/15 15 0.02 4 120 120 0/20 20 0.04 20 600 600 v oh high-level output voltage 0/5 <1 5 4.95 4.95 4.95 v 0/10 <1 10 9.95 9.95 9.95 0/15 <1 15 14.95 14.95 14.95 v ol low-level output voltage 5/0 <1 5 0.05 0.05 0.05 10/0 <1 10 0.05 0.05 0.05 15/0 <1 15 0.05 0.05 0.05 v ih high-level input voltage 0.5/4.5 <1 5 3.5 3.5 3.5 1/9 <1 10 7 7 7 1.5/13.5 <1 15 11 11 11 v il low-level input voltage 4.5/0.5 <1 5 1.5 1.5 1.5 9/1 <1 10 3 3 3 13.5/1.5 <1 15 4 4 4 i oh output drive current 0/5 2.5 <1 5 -0.8 -1.6 -0.65 -0.65 ma 0/5 4.6 <1 5 -0.2 -0.4 -0.18 -0.18 0/10 9.5 <1 10 -0.45 -0.9 -0.38 -0.38 0/15 13.5 <1 15 -1.5 -3 -1.25 -1.25 i ol output sink current 0/5 0.4 <1 5 3 4 2.4 2.4 0/10 0.5 <1 10 8 10 6.4 6.4 0/15 1.5 <1 15 24 36 19 19 i i input leakage current 0/18 any input 18 10 -5 0.1 1 1a c i input capacitance any input 5 7.5 pf 1. the noise margin for both level ?1? and ?0? is: 1 v min. with v dd = 5 v, 2 v min. with v dd = 10 v, 2.5 v min. with v dd = 15 v.
docid8190 rev 8 7/13 hcf4010 electrical characteristics 13 figure 3. test circuit 1. c l = 50 pf or equivalent (includes jig and probe capacitance). 2. r l = 200 k . 3. r t = z out of pulse generator (typically 50 ). table 7. dynamic elec trical characteristics (t amb = 25 c, c l = 50 pf, r l = 200 k , t r = t f = 20 ns) symbol parameter test condition value (1) unit v dd (v) v i (v) v cc (v) min. typ. max. t tlh output transition time 5 5 5 150 350 ns 10 10 10 75 15 15 15 15 55 110 t thl output transition time 555 3570 10 10 10 20 40 15 15 15 15 30 t plh propagation delay time 5 5 5 100 200 10 10 10 50 100 10 10 5 50 100 15 15 15 35 70 15 15 5 35 70 t phl propagation delay time 5 5 5 65 130 10 10 10 35 70 10 10 5 30 70 15 15 15 25 50 15 15 5 20 40 1. typical temperature coefficient for all v dd values is 0.3%/c.
electrical characteristics hcf4010 8/13 docid8190 rev 8 figure 4. waveform - propagation delay times (f = 1 mhz; 50% duty cycle)
docid8190 rev 8 9/13 hcf4010 package information 13 4 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack specifications, grade definitions a nd product status are available at: www.st.com . ecopack is an st trademark.
package information hcf4010 10/13 docid8190 rev 8 4.1 so16 package information figure 5. so16 package outline table 8. so16 package mechanical data symbol dimensions mm inch min. typ. max. min. typ. max. a 1.75 0.068 a1 0.1 0.25 0.004 0.010 a2 1.64 0.063 b 0.35 0.46 0.013 0.018 b1 0.19 0.25 0.007 0.010 c 0.5 0.019 c1 45 (typ.) d 9.8 10 0.385 0.393 e 5.8 6.2 0.228 0.244 e 1.27 0.050 e3 8.89 0.350 f 3.8 4.0 0.149 0.157 g 4.6 5.3 0.181 0.208 l 0.5 1.27 0.019 0.050 m 0.62 0.024 s 8 (max.) 0016020d
docid8190 rev 8 11/13 hcf4010 package information 13 figure 6. so16 tape and reel information 1. drawing not in scale. . table 9. so16 tape and reel information symbol dimensions mm inch min. typ. max. min. typ. max. a 330 12.992 c 12.8 13.2 0.504 0.519 d 20.2 0.795 n 60 2.362 t 22.4 0.882 ao 6.45 6.65 0.254 0.262 bo 10.3 10.5 0.406 0.414 ko 2.1 2.3 0.082 0.090 po 3.9 4.1 0.153 0.161 p 7.9 8.1 0.311 0.319
ordering information hcf4010 12/13 docid8190 rev 8 5 ordering information 6 revision history table 10. order codes order code temperature range package packing marking hcf4010m013tr ?55 c to +125 c so16 tape and reel hcf4010 HCF4010YM013TR (1) 1. qualification and characterization according to aec q100 and q003 or equi valent, advanced screening according to aec q001 and q002 or equivalent. ?40 c to +125 c so16 (automotive grade) hcf4010y table 11. document revision history date revision changes 16-mar-2005 3 add v cc on table 6 11-jun-2012 4 added applications on page 1 updated table 1: device summary removed dip16 package from document revised document presentati on, minor textual updates 15-jun-2012 5 updated temperature range in table 1 updated t op in table 5 19-oct-2012 6 updated features (added esd data). updated table 1 (added marking, updated note 1. ) reformatted section 4 (added figure 5 and figure 6 , table 8 and table 9 ). minor corrections throughout document. 25-apr-2013 7 updated features : esd data modified, removed information regarding b series cmos devices. added section 5: ordering information 13-jan-2014 8 table 1: device summary : added ?packing?
docid8190 rev 8 13/13 hcf4010 13 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems wi th product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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